Compression and cold weld sealing methods and devices

摘要

A method of forming an electrical via connection by compressing a first non-conductive substrate having an aperture comprising a layer of a first electrically conductive material with a second non-conductive substrate having a projecting member which is formed of or coated with a second electrically conductive material. The compression locally deforms and shears the first and/or second electrically conductive materials to form a bond and electrical connection between the first and second electrically conductive materials. An electrical via is made by the method.