| 摘要 |
<p>The present invention relates to a novolak resin and a manufacturing method thereof and, more specifically, a novolak resin which meets a condition like resistance to high heat that a copper-clad laminate substrate used in a printed circuit substrate, a sealing material, a molding material, a casting material, an adhesive and a material for an electrical insulating paint used in electronic parts may require while improving a low dielectric property, and a manufacturing method thereof.</p> |
