| 摘要 |
Provided is a system for treating a substrate in the present invention. The system for treating a substrate comprises: a first chamber; a second chamber stacked in an upper portion of the first chamber; substrate transfer members respectively arranged in the first chamber and the second chamber, enabling to transfer the substrate in one direction, and supporting the substrate which is not transferred; a lifting member located in the front of the first chamber, and enabling to be lifted to deliver the substrate to the substrate transfer member in the first chamber and the substrate transfer member in the second chamber; first developer supply members respectively provided in the first chamber and the second chamber, and firstly supplying a developer to the transferred substrate; fluid supply members respectively provided in the rear of the first developer supply members in a transfer direction of the substrate, and supplying a developer removal fluid to the substrate where the developer is firstly coated; second developer supply members respectively provided in the rear of the first developer supply members in the transfer direction of the substrate, and secondly supplying the developer to the substrate where the developer removal fluid is supplied; and a control member where the substrate is moved while the developer is firstly supplied, and controlling the substrate transfer members to make a movement of the substrate be stopped for a preset treatment hour after the developer is firstly coated. |
