NANO COPPER OXIDE INK COMPOSITION WITH HIGH HEAT RESISTANCE AND MANUFACTURING METHOD OF ELECTRODE USING THE SAME

摘要

The present invention relates to a copper oxide ink composition and a manufacturing method of an electrode using the same, and more specifically, to a composition which is capable of soldering due to excellent thermal resistance and enables to reduce a process time and to reduce process costs as well as minimizing damage of a substrate by a sintering process through a light radiation. According to the present invention, the copper oxide ink composition comprises: a copper particle or a copper precursor having copper oxide and a copper oxide film; a reducing agent for reducing copper which is oxidized by the light radiation; a binder including epoxy acrylate, polyvinyl acetal, and phenol-based resin; and a solvent.