RECYCLING SUBSTRATE STRUCTURE INCLUDING STRAIN COMPENSATION LAYER, MAKING METHOD THEREFOR AND DEVICE MANUFACTURING METHOD

摘要

According to an aspect of the present invention, provided is a producing method of a substrate recycling structure comprising: a substrate preparation step of preparing a substrate; a sacrificial layer growth step of growing a sacrificial layer capable of growing the sacrificial layer having a different lattice constant with the substrate on the substrate; a compensation layer growth step of growing a compensation layer having an opposite tension state with a tension state between the substrate and the sacrificial layer on the sacrificial layer; a device layer forming step of growing a device layer on the compensation layer. According to the reviewed present invention, a device can be easily removed by growing the sacrificial layer thick.