A COPPER PLATING SOLUTION CONTAINING QUINOLINIUM LEVELER AND COPPER PLATING METHOD USING THE SAME

摘要

The present invention relates to a copper plating solution having a quinolinium based leveler. The present invention can provides the plating solution having a leveler, where one or more substituents having a double bond are coupled to quinolinium or isoquinolinium, and a method for plating copper using the same. According to another aspect of the present invention, the method for plating copper plates a base using the copper plating solution. According to the present invention, the present invention is capable of plating by a bottom-up method when the present invention uses the copper plating solution and preventing generation of a seam or void so as to improve reliability of a product.