| 摘要 |
A dielectric film forming apparatus and a method for forming a dielectric film so as to form a dielectric film with a (100) / (001) orientation. A dielectric film forming apparatus 10 includes a deposition preventive plate heating portion 19 that heats a deposition preventive plate 34 disposed in a position where particles discharged from a target 21 adhere. Sputtering gas is introduced from a sputtering gas introduction unit 14 into a vacuum chamber 11. The deposition preventive plate 34 is heated to a temperature higher than a film forming temperature so as to emit vapor from a thin film adhered to the deposition preventive plate 34. After a seed layer is formed on a substrate 31, the substrate 31 is heated to the film forming temperature, and AC voltage is applied to the target 21 from a power supply 13 and then, the target 21 is sputtered so as to form a dielectric film on the substrate 31. |
