Device for connecting nano-objects to external electrical systems, and method for manufacturing the device

摘要

The device has upper and lower levels (6, 10) respectively including electrically insulating or semiconductive layer (16) and electrically insulating layer (18). A bonding layer (20) is arranged between one of the layers and an intermediate level, and includes electrical through vias in contact with lower contact pads (12). The intermediate level connects the vias with electrical contact elements, and includes a stack of intermediate layers (23, 24) equipped with electrically conductive lines (25) and electrical through vias (26) electrically insulated from rest of the corresponding layer. An independent claim is also included for a method for manufacturing a device for connecting a nano-object to an external electrical system.