| 摘要 |
<p>The present invention relates to a novolak resin and a manufacturing method thereof and, more specifically, to a novolak resin which meets conditions like low dielectric properties and resistance to high heat that a copper-clad laminate substrate used in a printed circuit substrate, a sealing material, a molding material, a casting material, an adhesive and a material for an electrical insulating paint used in electronic parts may require while improving adhesive force and fragile properties of the resin after resin is completely cured, thereby preventing separation caused by thermal and mechanical impact, and to a manufacturing method thereof.</p> |
