| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To uniformize a thickness in each film pattern by controlling an air flow to reduce the variation of a shape of a film pattern formed on a substrate surface. <P>SOLUTION: A liquid applying apparatus 100 has a liquid discharge head 10 which is relatively moved with respect to a substrate 1 to apply a liquid to one side 1a of the substrate 1. The liquid applying apparatus 100 is provided with a plate 4 disposed in a part where the liquid 2 is applied on the one side 1a of the substrate 1 of the liquid discharge head 10. The plate 4 is provided with a plurality of pores for allowing a liquid volatile component volatilized in a space R between the one side 1a of the substrate 1 and one surface 4a of the plate 4 to pass on a surface 4b side of the plate 4 not opposed to the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
