| 发明名称 |
SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF |
| 摘要 |
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed. |
| 申请公布号 |
EP2714962(B1) |
申请公布日期 |
2015.07.08 |
| 申请号 |
EP20120727173 |
申请日期 |
2012.05.23 |
| 申请人 |
SHIKOKU CHEMICALS CORPORATION |
发明人 |
HIRAO, HIROHIKO;YAMAJI, NORIAKI;NAKANISHI, MASATO;MURAI, TAKAYUKI |
| 分类号 |
C23C22/52;B23K35/36;C07D233/64;C23F11/14;C23F11/16;H05K3/28 |
主分类号 |
C23C22/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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