| 主权项 |
1. An imaging module comprising:
a support assembly, said support assembly having a back end, a front end, said support assembly having first, second, third, and fourth post holes for accommodating first, second third, and fourth support posts; a first circuit board disposed rearward of said support assembly; a two dimensional CMOS image sensor mounted to said first circuit board; a second circuit board having a central aperture carrying illumination LEDs, said second circuit board being disposed forwardly of said front end of said support assembly, said second circuit board having first, second, third, and fourth post holes for accommodating said first, second, third, and fourth support posts; a plurality of illumination LEDs carried by said second circuit board; a plurality of aiming LEDs; imaging optics supported by said imaging module; an optical plate having a central aperture disposed forwardly of said second circuit board, said optical plate having illumination optics for shaping light from said plurality of illumination LEDs and aiming optics for shaping light from said plurality of aiming LEDs, said optical plate having first, second, third, and fourth post holes for accommodating said first, second, third, and fourth support posts; first, second, third, and fourth support posts extending through said first, second, third, and fourth post holes of said optical plate, said second circuit board and said support assembly. |
