| 摘要 |
The present invention relates to a photosensitive resin composition including (A) an alkali soluble resin, (B) a compound having at least one ethylene-based unsaturated double bond in one molecule thereof, (C) a light radical polymerization initiator having a keto-type oxime ester, and (D) a compound represented by Chemical formula (1) or (2). A content (weight) of the light radical polymerization initiator (C) is 0.5-5 times of a content (weight) of the compound (D). A content of the light radical polymerization initiator (C) is 3-20 parts by weight with respect to 100 parts by weight of the compound (B). In Chemical formula (1), Six units of R^1 are independently a hydrogen atom or an electron donating group and n is 0 or 1. In the Chemical formula (2), six units of R^2 are independently a hydrogen atom or an electron donating group and m is 0 or 1. When the photosensitive resin composition and a method for forming a photoresist pattern are used, the resist pattern with high resolution can be formed even without using an oxygen inhibition layer. |
