Chip-type ceramic electronic component and producing method thereof

摘要

The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz1 and Rz2 satisfies the following requirement:
Rz1>Rz2,Rz1>3.3 μm, andRz2<3.2 μm,wherein Rz1 is a ten-point average surface roughness of a first region of a surface of the ceramic base body to which the tip portion is bonded, and Rz2 is a ten-point average surface roughness of a second region of the surface of the ceramic base body where the external electrode is not formed.

主权项

1. A chip-type ceramic electronic component comprising:
a ceramic base body having a first end face and a second end face opposed to the first end face, and a plurality of side faces connecting the first end face and the second end face to each other; an external electrode extending from one of the first end face and the second end face onto at least one side face of the plurality of side faces and not onto the other of the first end face and the second end face, the external electrode including a tip portion extending onto the at least one side face of the plurality of side faces, wherein the tip portion is constituted by a resin electrode comprising a resin and a conductive component; wherein a relationship between Rz1 and Rz2 satisfies the following requirement:
Rz1>Rz2,Rz1>3.3 μm, andRz2<3.2 μm, and wherein Rz1 is a ten-point average surface roughness of a first region of a surface of the ceramic base body to which the tip portion of the external electrode is bonded, and Rz2 is a ten-point average surface roughness of a second region of the surface of the ceramic base body where the external electrode is not located.