Method for manufacturing printed wiring board

摘要

A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening.

主权项

1. A method for manufacturing a printed wiring board, comprising:
preparing a core substrate; forming a penetrating hole in the core substrate; forming a first conductor on a first surface of the core substrate; forming a second conductor on a second surface of the core substrate on an opposite side of the first surface of the core substrate; and filling a conductive material in the penetrating hole such that a through-hole conductor is formed in the penetrating hole and the first conductor and the second conductor are connected via the through-hole conductor, wherein the forming of the penetrating hole comprises forming a first opening portion in the first surface of the core substrate, forming a second opening portion from a bottom portion of the first opening portion toward the second surface such that the second opening portion forms a first bent portion connected to the first opening portion and has a diameter which is smaller than a diameter of the first opening portion, forming a third opening portion in the second surface of the core substrate, and forming a fourth opening portion from a bottom portion of the third opening portion toward the first surface such that the fourth opening portion forms a second bent portion connected to the third opening portion and a third bend portion connected to the second opening portion and has a diameter which is smaller than a diameter of the third opening portion, the first opening portion inclines at an angle θ1 and the second opening portion inclines at an angle θ2 such that θ1>θ2 is satisfied with respect to an axis normal to the first and second surfaces, and the third opening portion inclines at an angle θ3 and the fourth opening portion inclines at an angle θ4 such that θ3>θ4 is satisfied with respect to the axis normal to the first and second surfaces.