Multichip package structure for directly electrically connecting to an AC power source

摘要

A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.

主权项

1. A multichip package structure for directly electrically connecting to an AC power source, comprising:
a substrate unit including a substrate body having a first chip-placing region and a second chip-placing region formed on the top surface of the substrate body; a light-emitting unit including a plurality of light-emitting chips electrically connected to and disposed on the first chip-placing region; a control module including at least one current-limiting unit and at least one rectifier unit electrically connected to and disposed on the second chip-placing region, wherein the current-limiting unit and the rectifier unit are electrically connected to the light-emitting unit; a frame unit including a first annular colloid frame and a second annular colloid frame, wherein the first annular colloid frame surrounds the light-emitting chips to form a first colloid position limiting space corresponding to the first chip-placing region, and the second annular colloid frame surrounds the current-limiting unit and the rectifier unit to form a second colloid position limiting space corresponding to the second chip-placing region; and a package unit including a first package colloid body filled into the first colloid position limiting space to cover the light-emitting chips and a second package colloid body filled into the second colloid position limiting space to cover the current-limiting unit and the rectifier unit; wherein the first annular colloid frame is surroundingly coated on the top surface of the substrate body from a first initial point to a first terminal point, the position of the first initial point and the position of the first terminal point are substantially the same, such that the first annular colloid frame has a first micro convex portion adjacent to the first initial point and the first terminal point; wherein the second annular colloid frame is surroundingly coated on the top surface of the substrate body from a second initial point to a second terminal point, the position of the second initial point and the position of the second terminal point are substantially the same, such that the second annular colloid frame has a second micro convex portion adjacent to the second initial point and the second terminal point.