ADHSIVE COMPOSITION, COVERLAY FILM AND COPPER CLAD LAMINATE USING THE SAME

摘要

The present invention relates to an adhesive composition including (A) a halogen-free epoxy resin with respect to 100 parts by weight; (B) 30-150 parts by weight of a thermoplastic resin; (C) 5-20 parts by weight of a curing agent; and (D) 10-50 parts by weight of an inorganic filler, and a copper clad laminate and a coverlay film using the same wherein the adhesive composition is used for manufacturing the coverlay film or copper clad laminate, which are halogen-free, thereby hardly generating harmful gas to human body when being burnt wherein the coverlay film is as an insulating film and uses polyether sulfone films, thereby reducing manufacturing cost compared with an existing FPCB using polyimide films while being used in process where a UV curing is required.