发明名称 Connector assembly
摘要 A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.
申请公布号 US9077127(B2) 申请公布日期 2015.07.07
申请号 US201313935280 申请日期 2013.07.03
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 Iwano Hiroshi;Iida Mitsuru;Sato Daisuke;Takeyama Hidetoshi
分类号 H01R12/77;H01R13/20;H01R12/79 主分类号 H01R12/77
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A connector assembly, comprising: a female connector comprising: a film substrate which is made from insulating material shaped in a thin board shape with flexibility; and a through hole pierced in the film substrate in a thickness direction thereof; and a pad which has electrical conductivity and is formed on a surface of the film substrate around the through hole; and a male connector comprising a conductive protrusion adapted to be inserted into the through hole to be electrically connected to the pad, wherein: the film substrate comprises a slot that is formed to extend along a plane of the film substrate and one end side of the slot is connected to the through hole, and the film substrate comprises non-pad part without the pad, the non-pad part being placed at least part of a region, on the surface of the film substrate, which is present at another end side of the slot and free to be bent by the conductive protrusion, the non-pad part adjoining the slot with no pad intervening between the slot and the non-pad part.
地址 Osaka JP