| 发明名称 |
Method for manufacturing a component by selective laser melting |
| 摘要 |
A method of manufacturing a component by selective laser melting and to provide heat treatment to the component is provided. The method includes building a heat treatment device adapted to provide a heat treatment to the component as part of the same selective laser melting for manufacturing the component and providing a heat treatment to the component by the heat treatment device. |
| 申请公布号 |
US9073150(B2) |
申请公布日期 |
2015.07.07 |
| 申请号 |
US201113813968 |
申请日期 |
2011.07.20 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
Graichen Andreas |
| 分类号 |
B23P6/00;B23K26/30;B22F9/24;B23K26/08;B23K26/34;H05B6/10;B23K26/32 |
主分类号 |
B23P6/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a component in a selective laser melting chamber arrangement by selective laser melting, comprising:
building a heat treatment device through a selective laser melting process, adapted to provide a heat treatment to the component as part of the selective laser melting chamber arrangement for manufacturing the component; and providing a heat treatment to the component by the heat treatment device. |
| 地址 |
München DE |
