| 摘要 |
The present invention relates to an apparatus for treating a substrate, which improves effectiveness for treating the substrate. According to an embodiment of the present invention, the apparatus for treating the substrate comprises: a first chamber; a second chamber adjacent to the first chamber; return units respectively arranged in the first chamber and the second chamber, and returning the substrate; a first nozzle spraying a first fluid to an area on the substrate located on the first chamber; and a second nozzle spraying a second fluid to an area on the substrate located on the second chamber, wherein the first nozzle and the second nozzle are integrated. |
