| 摘要 |
<p>Disclosed is an apparatus for treating substrates. The apparatus for treating substrates comprises: a process chamber in which a space is formed inside; a substrate transfer member located in the process chamber and transferring the substrates; a treatment liquid supply member located at the top of the substrate transfer member, and supplying a treatment liquid to the substrate transferred by the substrate transfer member; an exhaust member connected with an exhaust port formed in the process chamber, and discharging mist generated in the treatment liquid supplied to the substrate to the outside; and a gas spray member arranged in the process chamber, crossing an upper area of the substrate transferred by the substrate transfer member, and spraying gas to the exhaust side.</p> |
