发明名称 |
Scaling of bipolar transistors |
摘要 |
Bipolar transistor structures, methods of designing and fabricating bipolar transistors, methods of designing circuits having bipolar transistors. The method of designing the bipolar transistor includes: selecting an initial design of a bipolar transistor; scaling the initial design of the bipolar transistor to generate a scaled design of the bipolar transistor; determining if stress compensation of the scaled design of the bipolar transistor is required based on dimensions of an emitter of the bipolar transistor after the scaling; and if stress compensation of the scaled design of the bipolar transistor is required then adjusting a layout of a trench isolation layout level of the scaled design relative to a layout of an emitter layout level of the scaled design to generate a stress compensated scaled design of the bipolar transistor. |
申请公布号 |
US9076810(B2) |
申请公布日期 |
2015.07.07 |
申请号 |
US201414508011 |
申请日期 |
2014.10.07 |
申请人 |
International Business Machines Corporation |
发明人 |
Joseph Alvin J.;Malladi Ramana M.;Slinkman James A. |
分类号 |
H01L21/331;H01L29/66;G06F17/50;H01L21/8249;H01L29/732;H01L21/762;H01L21/02;H01L21/311;H01L27/02 |
主分类号 |
H01L21/331 |
代理机构 |
Schmeiser, Olsen & Watts |
代理人 |
Schmeiser, Olsen & Watts ;Canale Anthony J. |
主权项 |
1. A method, comprising:
forming a trench in substrate, and filling said trench with dielectric material to form trench isolation surrounding and abutting a perimeter of a collector in said substrate; forming a base on said collector; forming an emitter in said base; removing all or a portion of said dielectric material from said trench; and forming a dielectric capping layer on exposed regions of said substrate, said base and said emitter and over said trench, said capping layer sealing an upper region of said trench and forming a void around said perimeter of said collector. |
地址 |
Armonk NY US |