发明名称 Scaling of bipolar transistors
摘要 Bipolar transistor structures, methods of designing and fabricating bipolar transistors, methods of designing circuits having bipolar transistors. The method of designing the bipolar transistor includes: selecting an initial design of a bipolar transistor; scaling the initial design of the bipolar transistor to generate a scaled design of the bipolar transistor; determining if stress compensation of the scaled design of the bipolar transistor is required based on dimensions of an emitter of the bipolar transistor after the scaling; and if stress compensation of the scaled design of the bipolar transistor is required then adjusting a layout of a trench isolation layout level of the scaled design relative to a layout of an emitter layout level of the scaled design to generate a stress compensated scaled design of the bipolar transistor.
申请公布号 US9076810(B2) 申请公布日期 2015.07.07
申请号 US201414508011 申请日期 2014.10.07
申请人 International Business Machines Corporation 发明人 Joseph Alvin J.;Malladi Ramana M.;Slinkman James A.
分类号 H01L21/331;H01L29/66;G06F17/50;H01L21/8249;H01L29/732;H01L21/762;H01L21/02;H01L21/311;H01L27/02 主分类号 H01L21/331
代理机构 Schmeiser, Olsen & Watts 代理人 Schmeiser, Olsen & Watts ;Canale Anthony J.
主权项 1. A method, comprising: forming a trench in substrate, and filling said trench with dielectric material to form trench isolation surrounding and abutting a perimeter of a collector in said substrate; forming a base on said collector; forming an emitter in said base; removing all or a portion of said dielectric material from said trench; and forming a dielectric capping layer on exposed regions of said substrate, said base and said emitter and over said trench, said capping layer sealing an upper region of said trench and forming a void around said perimeter of said collector.
地址 Armonk NY US