| 发明名称 | Chip thermistor and thermistor assembly board | ||
| 摘要 | A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body. | ||
| 申请公布号 | US9076576(B2) | 申请公布日期 | 2015.07.07 |
| 申请号 | US201113884390 | 申请日期 | 2011.10.18 |
| 申请人 | TDK CORPORATION | 发明人 | Saito Yo;Yamada Kouki;Murakami Yukihiro |
| 分类号 | H01C7/10;H01C7/00;H01C7/02;H01C7/04 | 主分类号 | H01C7/10 |
| 代理机构 | Oliff PLC | 代理人 | Oliff PLC |
| 主权项 | 1. A chip thermistor comprising: a thermistor element body having first and second principal faces opposed to each other in a first direction; first and second electrodes arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body; and a third electrode arranged so as to lap over the first and second electrodes, when viewed from the first direction, on the second principal face of the thermistor element body, wherein, when viewed from the first direction, the first principal face is located inside an outer contour line of the second principal face and the first and second electrodes are located inside an outer contour line of the third electrode. | ||
| 地址 | Tokyo JP | ||