发明名称 Semiconductor device and method of manufacturing the same
摘要 According to one embodiment, there is provided a semiconductor device using graphene, includes a catalyst layer formed on or in a substrate along with an interconnect pattern and a graphene layer formed on the catalyst layer. The graphene layer is arranged parallel to a narrower linewidth than the width of the interconnect pattern.
申请公布号 US9076795(B1) 申请公布日期 2015.07.07
申请号 US201414478996 申请日期 2014.09.05
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Saito Tatsuro;Wada Makoto;Isobayashi Atsunobu;Kajita Akihiro;Sakai Tadashi
分类号 H01L23/52;H01L23/532;H01L21/768;H01L23/528;H01L23/522 主分类号 H01L23/52
代理机构 Holtz, Holtz, Goodman & Chick PC 代理人 Holtz, Holtz, Goodman & Chick PC
主权项 1. A semiconductor device, comprising: a catalyst layer formed on or in a substrate along with an interconnect pattern; and a plurality of graphene layers formed on the catalyst layer, the plurality of graphene layers arranged in parallel in a narrower linewidth than a width of the interconnect pattern.
地址 Tokyo JP
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