Method and device for manufacturing semiconductor devices, semiconductor device and transfer member

摘要

Disclosed is a method for manufacturing semiconductor devices. Said method includes: a supply step in which a process liquid (19) that oxidizes and dissolves a target substrate (20) to be treated is supplied to the surface of said substrate (20) to be treated; a positioning step in which a mesh-like transferring member (10b) provided with a catalyst material is positioned near or in contact with the surface of the substrate (20) to be treated; and a concave or convex forming step in which a concave or convex is formed on the surface of the substrate (20) to be treated via the aforementioned supply and positioning steps. As opposed to existing manufacturing methods, which manufacture semiconductor devices provided with semiconductor substrates with highly arbitrary (i.e. not very reproducible) concaves or convexes, by forming an appropriate concave or convex or mesh at the transferring member step, the disclosed method can stably manufacture semiconductor devices provided with semiconductor substrates that have concaves or convexes of a fixed level.

主权项

1. A method for manufacturing a semiconductor device comprising:
a supply step of supplying a process liquid that comprises an oxidizing agent and a dissolving agent; a locating step of locating a transferring member including a catalyst material at a position in contact with or close to a portion of a surface of a semiconductor substrate, wherein in the locating step, the transferring member is rolled over the portion of the surface and loses a state of at least a part of the transferring member in contact with or close to the portion of the surface and gaining a state of at least a part of the transferring member in contact with or close to another portion of the surface; and a concave and convex forming step of forming the surface concaved or convexed or a pore forming step of forming the surface porous through the supply step and the locating step.