Methods for forming 3DIC package

摘要

A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.

主权项

1. An apparatus comprising:
an upper jig, wherein the upper jig forms a grid comprising a first plurality of through-openings, with the first plurality of through-openings forming grid openings of the grid, each of the first plurality of openings configured to surround a package on a package substrate strip; and a lower jig comprising:
a second plurality of through-openings, wherein with the lower jig aligned to the upper jig, the second plurality of through-openings is configured to be exposed through the first plurality of through-openings; anda planar top surface, wherein the second plurality of through-openings is configured to be fully covered by the package substrate strip.