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发明名称
HEAT GRINDING APPARATUS
摘要
<p>열가공 장치가 개시된다. 본 발명의 일 실시예에 따른 열가공 장치는, 기판을 가열하여 기판의 단부를 열가공시키는 가열 팁을 구비하는 열가공 가열 유닛; 및 가열 팁에 의해 열가공 작업이 완료된 기판을 향해 압축에어를 공급하여 열가공에 의해 기판으로부터 면취되어 분리되어야 할 칩(chip)의 분리 효율을 배가시키는 에어 블로우 유닛(air blow unit)을 포함한다.</p>
申请公布号
KR101534265(B1)
申请公布日期
2015.07.07
申请号
KR20130120018
申请日期
2013.10.08
申请人
发明人
分类号
C03B29/06;C03B29/08
主分类号
C03B29/06
代理机构
代理人
主权项
地址
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