发明名称 Oxide semiconductor, thin film transistor array substrate and production method thereof, and display device
摘要 The present invention provides an oxide semiconductor capable of achieving a thin film transistor having stable transistor characteristics, a thin film transistor having a channel layer formed of the oxide semiconductor and a production method thereof, and a display device equipped with the thin film transistor. The oxide semiconductor of the present invention is an oxide semiconductor for a thin film transistor. The oxide semiconductor includes indium, gallium, zinc, and oxygen as constituent atoms, and the oxygen content of the oxide semiconductor is 87% to 95% of the stoichiometric condition set as 100%, in terms of atomic units.
申请公布号 US9076718(B2) 申请公布日期 2015.07.07
申请号 US201414478055 申请日期 2014.09.05
申请人 Sharp Kabushiki Kaisha 发明人 Ohta Yoshifumi;Mori Go;Nishiki Hirohiko;Chikama Yoshimasa;Aita Tetsuya;Suzuki Masahiko;Nakagawa Okifumi;Takei Michiko;Harumoto Yoshiyuki;Hara Takeshi
分类号 H01L29/10;H01L21/00;H01L29/22;H01L29/45;H01L29/49;H01L29/66;H01L29/786;G02F1/1368;H01L21/02 主分类号 H01L29/10
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A thin film transistor substrate comprising: a substrate body: a gate electrode provided on the substrate body; a gate insulating film provided on the gate electrode; an oxide semiconductor film provided directly on the gate insulating film and including an overlapped portion that overlaps with the gate electrode; a source electrode provided on the oxide semiconductor layer; a drain electrode provided on the oxide semiconductor film and opposed to the source electrode at the overlapped portion; and a protective film provided on the overlapped portion of the oxide semiconductor film, the source electrode, and the drain electrode, wherein the protective film includes material containing an oxygen atom and is in direct contact with a portion of the oxide semiconductor film, the oxide semiconductor film is sandwiched by the gate insulating film and the protective film in a thickness direction of the substrate body, the oxide semiconductor film includes indium, gallium, zinc and oxygen as constituent atoms, and the oxygen content of the oxide semiconductor, which directly contacts both the gate insulating film and the protective film, is 87% to 95% in accordance with the following formula: O(atomic %)/{In(atomic %)×3/2+Ga(atomic %)×3/2+Zn(atomic %)}.
地址 Osaka JP