发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING APPARATUS AND PROGRAM
摘要 The purpose of the present invention is to increase controllability of a composition ratio and film properties when forming a thin film. A method for manufacturing a semiconductor device performs a cycle including a process of forming a first film including at least a small amount of elements, boron, and nitrogen, and not containing borazine ring structure, and a process of forming a second film including at least a small amount of elements and borazine ring structure several times, and forms a laminate film in which the first film and the second film are arranged in layers on a substrate.
申请公布号 KR20150077357(A) 申请公布日期 2015.07.07
申请号 KR20140189424 申请日期 2014.12.26
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 SANO ATSUSHI;HIROSE YOSHIRO
分类号 H01L21/20;H01L21/02 主分类号 H01L21/20
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