| 发明名称 | Light emitting device package | ||
| 摘要 | A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body. | ||
| 申请公布号 | US9076949(B2) | 申请公布日期 | 2015.07.07 |
| 申请号 | US201414496486 | 申请日期 | 2014.09.25 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Kim Byung Mok;Kang Bo Hee;Kim Ha Na;Kodaira Hiroshi;Tanda Yuichiro;Ozeki Satoshi |
| 分类号 | H01L33/64;A61L2/08;F21V31/00;H01L33/62;A61L2/10 | 主分类号 | H01L33/64 |
| 代理机构 | Birch, Stewart, Kolasch & Birch, LLP | 代理人 | Birch, Stewart, Kolasch & Birch, LLP |
| 主权项 | 1. A light emitting device package comprising: a package body; at least one electrode pattern placed on the package body; at least one light emitting device electrically connected to the electrode pattern; a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device; and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body. | ||
| 地址 | Seoul KR | ||