Method and structures for via substrate repair and assembly

摘要

A component can include a substrate having an opening extending between first and second surfaces thereof, and an electrically conductive via having first and second portions. The first portion can include a first layer structure extending within the opening and at least partially along an inner wall of the opening, and a first principal conductor extending within the opening and at least partially overlying the first layer structure. The first portion can be exposed at the first surface and can have a lower surface located between the first and second surfaces. The second portion can include a second layer structure extending within the opening and at least partially along the lower surface of the first portion, and a second principal conductor extending within the opening and at least partially overlying the second layer structure. The second portion can be exposed at the second surface.

主权项

1. A component, comprising:
a substrate having a first surface, a second surface opposite from the first surface, and an opening extending between the first and second surfaces, the opening having an inner wall extending between the first and second surfaces, a dielectric material being exposed at the inner wall; and an electrically conductive via, including:
a first portion including a first layer structure extending within the opening and at least partially along the inner wall, the first layer structure contacting the dielectric material exposed at the inner wall, and a first principal conductor extending within the opening and at least partially overlying the first layer structure within the opening, the first portion being exposed at the first surface and having a concave lower surface located between the first and second surfaces, a center of the concave lower surface being located closer to the first surface of the substrate than a periphery of the concave lower surface; anda second portion including a second layer structure extending within the opening and at least partially along the lower surface of the first portion, the second layer structure contacting the dielectric material exposed at the inner wall and extending into a concavity defined by the concave lower surface of the first portion, and a second principal conductor extending within the opening and at least partially overlying the second layer structure within the opening, the second principal conductor extending from the second layer structure towards the second surface, the second portion being exposed at the second surface.