The present invention relates to an electronic device module. The electronic device module according to one embodiment of the present invention includes a substrate which has a cavity inside, a heat sink which is arranged on the inlet of the cavity, and an electronic device which is embedded in the cavity to be attached to one side of the heat sink.
申请公布号
KR20150076816(A)
申请公布日期
2015.07.07
申请号
KR20130165429
申请日期
2013.12.27
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
WON, JUN GOO;PARK, SUNG HWAN;HAN, MYEONG WOO;BAE, HYO GUN;KIM, YOUN SUK;KIM, KI JOONG
