SEMICONDUCTOR DEVICE PACKAGE, LIGHT DIODE PACKAGE AND OPTICAL MODULE INCLUDING THE SAME

摘要

The present invention relates to a semiconductor device package capable of removing and replacing an upper substrate of the semiconductor device package, and a light diode package and an optical module including the same. The semiconductor device package according to the present invention includes a lower substrate; the upper substrate which is arranged on the lower substrate and is for mounting a semiconductor device; and at least one combination fixture which detachably combines the upper substrate with the lower substrate.