发明名称 |
Composition for resist underlayer film, process for forming resist underlayer film, patterning process, and fullerene derivative |
摘要 |
The invention provides a composition for a resist underlayer film, the composition for a resist underlayer film to form a resist underlayer film of a multilayer resist film used in lithography, wherein the composition comprises at least (A) a fullerene derivative that is a reaction product of a substance having a fullerene skeleton with a 1,3-diene compound derivative having an electron-withdrawing group and (B) an organic solvent. There can be a composition for a resist underlayer film for a multilayer resist film used in lithography, the composition giving a resist underlayer film having excellent high dry etching resistance, capable of suppressing wiggling during substrate etching with high effectiveness, and capable of avoiding a poisoning problem in upperlayer patterning that uses a chemical amplification resist; a process for forming a resist underlayer film; a patterning process; and a fullerene derivative. |
申请公布号 |
US9076738(B2) |
申请公布日期 |
2015.07.07 |
申请号 |
US201113183175 |
申请日期 |
2011.07.14 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
Watanabe Takeru;Fujii Toshihiko;Kinsho Takeshi;Ogihara Tsutomu |
分类号 |
H01L21/311;C07C69/753;G03F7/11;H01L21/027 |
主分类号 |
H01L21/311 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A composition for a resist underlayer film of a multilayer resist film used in lithography, wherein the composition comprises at least (A) a fullerene derivative having an electron-withdrawing group and that is a reaction product of a substance having a fullerene skeleton with a 1,3-diene compound derivative having an electron-withdrawing group and (B) an organic solvent. |
地址 |
Tokyo JP |