发明名称 Composition for resist underlayer film, process for forming resist underlayer film, patterning process, and fullerene derivative
摘要 The invention provides a composition for a resist underlayer film, the composition for a resist underlayer film to form a resist underlayer film of a multilayer resist film used in lithography, wherein the composition comprises at least (A) a fullerene derivative that is a reaction product of a substance having a fullerene skeleton with a 1,3-diene compound derivative having an electron-withdrawing group and (B) an organic solvent. There can be a composition for a resist underlayer film for a multilayer resist film used in lithography, the composition giving a resist underlayer film having excellent high dry etching resistance, capable of suppressing wiggling during substrate etching with high effectiveness, and capable of avoiding a poisoning problem in upperlayer patterning that uses a chemical amplification resist; a process for forming a resist underlayer film; a patterning process; and a fullerene derivative.
申请公布号 US9076738(B2) 申请公布日期 2015.07.07
申请号 US201113183175 申请日期 2011.07.14
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 Watanabe Takeru;Fujii Toshihiko;Kinsho Takeshi;Ogihara Tsutomu
分类号 H01L21/311;C07C69/753;G03F7/11;H01L21/027 主分类号 H01L21/311
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A composition for a resist underlayer film of a multilayer resist film used in lithography, wherein the composition comprises at least (A) a fullerene derivative having an electron-withdrawing group and that is a reaction product of a substance having a fullerene skeleton with a 1,3-diene compound derivative having an electron-withdrawing group and (B) an organic solvent.
地址 Tokyo JP