Thermoplastic composition for use in forming a laser direct structured substrate

摘要

A thermoplastic composition that contains a unique combination of a thermotropic liquid crystalline polymer, dielectric material, laser activatable additive, and a fibrous filler is provided. The nature of the components and/or their concentration are selectively controlled in the present invention to maintain a high dielectric constant, good mechanical properties (e.g., deflection under load), and good processibility (e.g., low viscosity), yet still be laser activatable. Thus, the thermoplastic composition can be readily shaped into a thin substrate and subsequently applied with one or more conductive elements using a laser direct structuring process (“LDS”).

主权项

1. A thermoplastic composition that comprises:
from about 20 wt. % to about 80 wt. % of at least one thermotropic liquid crystalline polymer; from about 0.1 wt. % to about 30 wt. % of at least one laser activatable additive, wherein the laser activatable additive includes spinel crystals; from about 1 wt. % to about 50 wt. % of at least one dielectric material; and from about 5 wt. % to about 50 wt. % of at least one fibrous filler, wherein the weight ratio of the fibrous filler to the combined amount of the laser activatable additive and the dielectric material is from about 0.4 to about 2.0; wherein the thermoplastic composition exhibits a dielectric constant of greater than about 4.4, as determined at a frequency of 2 GHz, and further wherein the melting temperature of the thermoplastic composition is from about 250° C. to about 440° C., and wherein the composition exhibits a deflection temperature under load such that the ratio of the deflection temperature under load to the melting temperature is from about 0.67 to about 1.00, the deflection temperature under load being determined in accordance ISO Test No. 75-2 at a load of 1.8 Megapascals.