| 摘要 |
The present invention is to a LED lighting apparatus which improves a heat transfer and heat radiation structure to emit heat generated from a LED smoothly, and solves rigidity problems, thereby securing reduction of thermal diffusion and thermal resistance, and enough rigidity. According to an embodiment of the present invention, the LED lighting apparatus comprises: a printed circuit substrate in which a LED chip or a package is mounted; a heat sink forming a sealing space which is in contact with the printed circuit substrate and where heat is transmitted inside, and emitting heat generated from the LED chip or the package; a refrigerant accommodated in the sealing space of the heat sink; a work structure attached on one side of an inner circumference surface of the heat sink and a contact surface of light sources, and providing a path in which the refrigerant moves; and a supported beam integrally formed from the center of the heat sink, and enlarged and supported on the printed circuit substrate. |
