发明名称 |
Power module package |
摘要 |
Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module. |
申请公布号 |
US9076660(B2) |
申请公布日期 |
2015.07.07 |
申请号 |
US201314103574 |
申请日期 |
2013.12.11 |
申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Kim Tae Hyun;Kim Kwang Soo;Yun Sun Woo;Lee Young Ki;Yoo Do Jae |
分类号 |
H01L23/12;H01L23/34;H01L23/053;H01L23/373 |
主分类号 |
H01L23/12 |
代理机构 |
Ladas & Parry, LLP |
代理人 |
Ladas & Parry, LLP |
主权项 |
1. A power module package, comprising:
a first module configured of a first substrate having one surface and another surface, a first semiconductor chip mounted on the one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on the one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate, the first module including a first surface parallel with one surface of the first substrate, a second surface parallel with both sides in a thickness direction of the first substrate, and a third surface on which the other surface of the first substrate is exposed; and a case enclosing the first module and configured of a first plate covering the first surface of the first module and a second plate covering the second surface of the first module; and a bonding member formed between the first surface of the first module and the first plate. |
地址 |
Gyunggi-Do, Korea KR |