| 发明名称 | Potting compound suitable for potting an electronic component | ||
| 摘要 | The invention relates to a potting compound suitable for potting an electronic component, in particular a large-volume coil such as a gradient coil, consisting of a supporting matrix in which at least one filler made of polymer nanoparticles is distributed. At least one filler (11) that is used as a flame retardant is introduced into the supporting matrix (8). | ||
| 申请公布号 | US9074108(B2) | 申请公布日期 | 2015.07.07 |
| 申请号 | US201113701509 | 申请日期 | 2011.05.13 |
| 申请人 | Siemens Aktiengesellschaft | 发明人 | Huber Jürgen;Schön Lothar;Übler Matthias |
| 分类号 | C09D147/00;G01R33/385;H01F5/06;C08K3/00;C08K5/00;H01F41/12 | 主分类号 | C09D147/00 |
| 代理机构 | Lempia Summerfield Katz LLC | 代理人 | Lempia Summerfield Katz LLC |
| 主权项 | 1. A magnetic resonance imaging compatible flame retardant potting compound suitable in potting an electronic gradient coil component, the potting compound comprising: a supporting matrix; a first filler comprising polymer nanoparticles; a second filler comprising an inorganic material; and a third filler that is used as a flame retardant and comprises Al(OH)3, Mg(OH)2, Sb2O3, brominated compounds, chlorinated compounds, halogenated compounds, halogen-free organophosphorous compounds, or a combination thereof wherein the first filler, the second filler, and the third filler are introduced into the supporting matrix, such that the potting compound is magnetic resonance imaging compatible, crack-resistant, flame retardant, and suitable in potting the electronic gradient coil component. | ||
| 地址 | München DE | ||