发明名称 MEMS microphone and electronic equipment having the MEMS microphone
摘要 The present invention provides a MEMS microphone and an electronic equipment having the MEMS microphone. The electronic equipment of the present invention at least comprises: a MEMS microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; the printed circuit board electrically connect with the pins of the MEMS microphone, which is used to output the electric signal generated by the microphone. The present invention avoids the sound air flow directly to the microphone chip, reduces dust interference on acoustic and electric sensor in microphone chip by means of changing the position of the sound hole of the microphone.
申请公布号 US9073747(B2) 申请公布日期 2015.07.07
申请号 US201314019768 申请日期 2013.09.06
申请人 SHANGAI SNIPER MICROELECTRONICS CO., LTD. 发明人 Ye Jinghua
分类号 H04R25/00;B81B3/00 主分类号 H04R25/00
代理机构 Beusse Wolter Sanks & Maire, P.A. 代理人 Sanks, Esq. Terry M.;Beusse Wolter Sanks & Maire, P.A.
主权项 1. A microelectromechanical system (MEMS) microphone, characterized by, at least comprises: a microphone chip containing an acoustic and electric sensor, converting sound wave into change of plate spacing of capacitance in the acoustic and electric sensor, and output electric signal about the change of voltage according to the change of plate spacing; a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side face of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; and a dust-proof component attached over the acoustic and electric sensor wherein the dust-proof component is attached on a side of the sound hole and aslant arranged over the acoustic and electric sensor.
地址 Shanghai CN