MEMS pressure sensor and manufacturing method therefor

摘要

A Micro Electromechanical System (MEMS) pressure sensor may include a first substrate provided with a sensitive diaphragm of a piezoresistive pressure sensing unit, an electrical connecting diffusion layer and a first bonding layer on a surface of the first substrate; and a second substrate provided with an inter-conductor dielectric layer, a conductor connecting layer in the inter-conductor dielectric layer and/or a second bonding layer on a surface of the second substrate. The second substrate may be arranged opposite to the first substrate, and the second substrate may be fixedly coupled to the first substrate via the first bonding layer and the second bonding layer; the pattern of the first bonding layer is corresponding to the pattern of the second bonding layer, and both the first bonding layer and the second bonding layer may be formed of a conductive material.

主权项

1. A Micro Electromechanical System (MEMS) pressure sensor comprising:
a first substrate provided with a sensitive diaphragm of a piezoresistive pressure sensing unit, an electrical connecting diffusion layer and a first bonding layer on a surface of the first substrate; a second substrate provided with an inter-conductor dielectric layer, a conductor connecting layer in the inter-conductor dielectric layer and/or a second bonding layer on a surface of the second substrate; and a reference pressure cavity which is disposed between the sensitive diaphragm and the second substrate, wherein the reference pressure cavity is a single cavity surrounded by a wall, the wall comprising at least one element selected from a group consisting of the first bonding layer and the second bonding layer; wherein the second substrate is arranged opposite to the first substrate, and the second substrate is fixedly coupled to the first substrate via the first bonding layer and the second bonding layer; the pattern of the first bonding layer is corresponding to the pattern of the second bonding layer, and both the first bonding layer and the second bonding layer are formed of a conductive material.