| 摘要 |
In the present invention, disclosed is an apparatus for treating a substrate, including a process chamber; a substrate transferring member installed in the process chamber to move the substrate in one direction and support the stopped substrate; a first developer supplying member installed in the upper part of the substrate transferring member to firstly supply a developer to the transferring substrate; a fluid supplying member installed on the rear part of the first developer supplying member along with the direction of the transferring substrate to supply fluid used for removing the developer on the substrate firstly coated with the developer; a second developer supplying member installed in the rear part of the first developer supplying member along with the direction of the transferring substrate to secondly supply the developer to the substrate having the fluid used for removing the developer; and a control member for controlling the substrate transferring member which enables the substrate to move when the developer is firstly supplied to the substrate, and to stop for predetermined hours after the substrate is firstly coated with the developer. |
