Substrate with built-in electronic component

摘要

Provided is a substrate with a built-in electronic component that can minimize an occurrence of a deformation such as warping or distortion of the substrate with a built-in electronic component, which is caused by a difference in rigidity between a region of low rigidity and a region of high rigidity that are formed in a core layer thereof. In the substrate with a built-in electronic component, electronic components 12 are respectively housed in a plurality of housing portions 11a1 that are formed in a core layer 11a, and in the core layer 11a, a plurality of openings 11a2 filled with an insulator 11k are formed.

主权项

1. A substrate with a built-in electronic component, comprising:
a core layer that has a housing portion formed therein to house an electronic component, wherein the core layer has an opening formed therein, an entirety of the opening being filled with an insulator without having an electronic component inserted therein during any usage of the substrate so that the opening acts as a measure to reduce differences in rigidity among plural regions of the core layer during an entire course of usage of the substrate with the built-in electronic component.