发明名称 Oscillator
摘要 An oscillator according to the disclosure includes a crystal unit, an IC chip, an adhesive agent flow prevention film, and a lead frame. The lead frame is disposed in a peripheral area of the pair of crystal terminals and the IC chip in an approximately same surface as the one surface of the flat container of the crystal unit. The lead frame includes a wiring part that is connected to an IC terminal of the IC chip by a bonding wire and is buried in the resin mold, and a mounting terminal forming portion that extends from the wiring part and is folded along an outside of the resin mold in a back surface that is another surface side opposite to the one surface of the crystal unit so as to form a mounting terminal.
申请公布号 US9077346(B2) 申请公布日期 2015.07.07
申请号 US201414472380 申请日期 2014.08.29
申请人 NIHON DEMPA KOGYO CO., LTD. 发明人 Asamura Fumio
分类号 H03L1/02;H03B5/30;H01L23/495 主分类号 H03L1/02
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. An oscillator, comprising: a crystal unit where a tuning-fork type crystal resonator is sealed in a flat container rectangular in plan view and a pair of crystal terminals is formed in one surface of the flat container; an IC chip, a surface opposite to an integrated circuit forming surface of the IC chip being bonded by an adhesive agent between the pair of crystal terminals on the one surface where the crystal terminal in the flat container of the crystal unit is formed, and the crystal unit and the IC chip being coated with a resin mold to render a single electronic component; an adhesive agent flow prevention film placed between each of the pair of crystal terminals and the IC chip to prevent the adhesive agent from flowing toward the pair of crystal terminals; and a lead frame disposed in a peripheral area of the pair of crystal terminals and the IC chip in an approximately same surface as the one surface of the flat container of the crystal unit, wherein the lead frame includes a wiring part that is connected to an IC terminal of the IC chip by a bonding wire and is buried in the resin mold, and a mounting terminal forming portion that extends from the wiring part and is folded along an outside of the resin mold in a back surface that is another surface side opposite to the one surface of the crystal unit so as to form a mounting terminal.
地址 Tokyo JP