Method of producing semiconductor module and semiconductor module

摘要

In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

主权项

1. A method of producing a semiconductor module, comprising:
a mounting step of mounting an electronic component on an individual module section of a top surface of a collective substrate; a sealing step of sealing the top surface on which the electronic component is mounted with an insulating sealing resin layer; a groove-forming step of forming in the sealing resin layer a groove having a depth that does not reach the collective substrate; a hole-forming step of forming a hole extending from a top surface of the sealing resin layer to a ground wiring provided at the collective substrate; a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer, an internal surface of the groove, a bottom surface of the groove, an internal surface of the hole, and the ground wiring; and a separation step of cutting the bottom surface of the groove to thereby separate from each other a plurality of individual module sections which the individual module section comprises.