| 摘要 |
<p>An adhesive tape which has high adhesion and is larger than the internal diameter of a chamber is attached to a bonding part of a pair of upper and lower housings of the chamber. After the chamber is formed by using the adhesive tape, the adhesive tape is preheated by a heater. After that, a wafer is closely moved to the bonding surface of the adhesive tape. The adhesive tape is attached to the wafer while reducing the internal pressure of the lower housing which supports and receives a wafer and is lower than the internal pressure of the upper housing. The flat surface of a pressing member pressurizes the surface of the adhesive tape attached to the circuit forming surface of a wafer so that the adhesive tape can be flat.</p> |
