| 摘要 |
<p>The purpose of the present invention is to provide the technology capable of maintaining adhesion between a surface treated copper foil and a resin substrate when a laminated plate is formed, and ensuring transparency of a resin substrate after a surface treated copper foil is removed from a laminated plate. To achieve the objective of the present invention, a copper substrate, and a surface treated layer formed in one main surface among copper substrates are equipped. When a resin substrate is bonded to a surface opposite to a side in contact with a copper foil substrate of a surface treated layer, strength between a surface treated layer and a resin substrate is 0.7 N/mm or more, and a HAZE value of a resin substrate is 80% or less after a resin substrate is bonded and a copper foil substrate and a surface treated layer are removed.</p> |
