INSULATING RESIN SHEET FOR FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD COMPRISING THE SAME

摘要

The present invention relates to an insulating resin sheet for forming a flexible printed circuit board (FPCB) including a polyimide film; a low dielectric constant polyphenylene ether (PPE) resin insulation layer formed on one side or both sides of the polyimide film; and a thermoplastic polyimide layer formed on the polyphenylene ether (PPE) resin insulation layer, and forming a certain surficial roughness on the surface, to a manufacturing method thereof, and to a flexible printed circuit board including the insulating resin sheet. Provided in the present invention are an insulating resin sheet achieving excellent additive, low dielectric constant, and a fine circuit pattern, and a buildup printed circuit board using the same.