| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface acoustic wave device capable of forming a metal bump without requiring a process of removing only a protection film on an electrode pad, and the surface acoustic wave device.SOLUTION: A surface acoustic wave device includes: a piezoelectric substrate 10; a thin film electrode including a pair of comb-shaped electrodes and an electrode pad 50 interdigitated with each other, which is disposed on the piezoelectric substrate 10; a lead wiring 30 disposed for electrically connecting the comb-shaped electrodes and the electrode pad; a metal bump 80 electrically connected with the electrode pad 50; and a protection film 60 disposed on the piezoelectric substrate 10 such that at least a part of the comb-shaped electrodes and the electrode 50 is covered. The protection film 60 is formed on the electrode pad 50, and the metal bump 80 is brought into contact with the protection film 60 such that a plurality of broken portions 62 are formed on the protection film 60, and that the metal bump 80 and the electrode pad 50 are bonded so as to be electrically connected via the broken portions 62 at the same time.</p> |
