| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder composition which can sufficiently suppress a change of copper foil color under a flux residue after soldering.SOLUTION: A solder composition of this invention, which contains a flux containing (A) a rosin-based resin, (B) an activator, (C) a solvent, and (D) an antioxidant, and (E) a solder powder, is characterized in that the (D) component is at least one selected from a group consisting of an organic sulfur diester compound having one or more sulfurs in a molecule and two or more ester bonds and a group consisting of a hindered phenol diamide compound having two or more amide bonds and a hindered phenol structure in a molecule. |
