COATED COPPER NANOPARTICLE, COATED NANOPARTICLE DISPERSION, AND METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a coated copper nanoparticle dispersion excellent in oxidation resistance, dispersibility, coating adaptability, and sintering property at a low temperature or in a short time, to be used for forming a circuit pattern by screen printing or inkjet printing.SOLUTION: A copper nanoparticle dispersion is provided, comprising the following copper nanoparticles dispersed in a solvent. The copper nanoparticle is coated with a copolymer of an alkyl amine, an unsaturated carboxylic acid, and an ethylenically unsaturated monomer, which has an average molecular weight of 1000 to 50000. A method for manufacturing a conductive substrate by applying and firing the above dispersion is provided. By the method, a film having high conductivity can be formed, in which an organic component is easily decomposed and removed from the film even by low-temperature and short-time firing.